SMIC cooperate with world-class OSAT to offer 200mm and 300mm wafer bumping and Wafer Level Packaging (WLP), including solder bump, copper pillar bump, redistribution layer (RDL), WLCSP processing and Die Processing Services (DPS).

SMIC cooperates with world-class OSATs to offer wire-bonding and flip chip packaging to meet various requirements from customers.

SMIC offers Wafer Probing and Final Test Services. Test platform includes J750 series, iFlex, ultra Flex, V93K, Pinscale series, D10/DX, V5400, T5375/5377, T5830 and others.

Toppan SMIC Electronics (Shanghai) Co., Ltd. provides On-chip Color Filter (OCF), Micro Lens’ design and manufacturing service.